HJ

Hyeong Kug Jin

SC Stats Chippac: 1 patents #282 of 425Top 70%
📍 Seoul, KR: #24,369 of 39,741 inventorsTop 65%
Overall (All Time): #3,236,311 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7863761 Integrated circuit package system with molding vents Dal Jae Lee, Nam Ju Cho, Soo-San Park, Jaepil Kim, Sungpil Hur +3 more 2011-01-04