Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9129978 | Integrated circuit packaging system with void prevention mechanism and method of manufacture thereof | Jaepil Kim, Seokhyun Kim, Daeup Bae, Jaewon Kim, Jaekang Yoo | 2015-09-08 |
| 7863761 | Integrated circuit package system with molding vents | Dal Jae Lee, Nam Ju Cho, Soo-San Park, Jaepil Kim, Hyeong Kug Jin +3 more | 2011-01-04 |