Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9129978 | Integrated circuit packaging system with void prevention mechanism and method of manufacture thereof | Jaepil Kim, Seokhyun Kim, Daeup Bae, Jaewon Kim, Sungpil Hur | 2015-09-08 |