Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7812435 | Integrated circuit package-in-package system with side-by-side and offset stacking | BumJoon Hong, Sang Ho Lee, Jong-Woo Ha | 2010-10-12 |
| 7763145 | System for removal of an integrated circuit from a mount material | — | 2010-07-27 |
| 7687919 | Integrated circuit package system with arched pedestal | — | 2010-03-30 |
| 7659609 | Integrated circuit package-in-package system with carrier interposer | Jong-Woo Ha, BumJoon Hong, Sang Ho Lee | 2010-02-09 |
| 7652376 | Integrated circuit package system including stacked die | Hyeog Chan Kwon, Sang Ho Lee, Jong-Woo Ha | 2010-01-26 |
| 7456088 | Integrated circuit package system including stacked die | Hyeog Chan Kwon, Sang Ho Lee, Jong-Woo Ha | 2008-11-25 |
| 7238258 | System for peeling semiconductor chips from tape | Gab Yong Min, Jin-Wook Jeong, Hee Bong Lee, Jason Lee | 2007-07-03 |