Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8093727 | Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof | Soo-San Park, BumJoon Hong, Sang Ho Lee | 2012-01-10 |
| 8067268 | Stacked integrated circuit package system and method for manufacturing thereof | Flynn Carson, BumJoon Hong, Seongmin Lee | 2011-11-29 |
| 8049322 | Integrated circuit package-in-package system and method for making thereof | Choong Bin Yim, Hyeog Chan Kwon | 2011-11-01 |
| 8039942 | Ball grid array package stacking system | — | 2011-10-18 |
| 8039365 | Integrated circuit package system including wafer level spacer | Sang Ho Lee, Soo-San Park | 2011-10-18 |
| 7994625 | Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof | DaeSik Choi, DeokKyung Yang, Byoung Wook Jang, JaeSick Bae, Seung-Won Kim | 2011-08-09 |
| 7968373 | Integrated circuit package on package system | Joosang Kim, DongSoo Moon | 2011-06-28 |
| 7951643 | Integrated circuit packaging system with lead frame and method of manufacture thereof | TaeWoo Kang, DongSoo Moon | 2011-05-31 |
| 7927917 | Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2011-04-19 |
| 7915724 | Integrated circuit packaging system with base structure device | Koo Hong Lee, Soo Won Lee, Juhyun Park, Zigmund Ramirez Camacho, Jeffrey D. Punzalan +2 more | 2011-03-29 |
| 7888184 | Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof | Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan, Seung Uk Yoon | 2011-02-15 |
| 7884460 | Integrated circuit packaging system with carrier and method of manufacture thereof | Choong Bin Yim, Hyeog Chan Kwon | 2011-02-08 |
| 7872340 | Integrated circuit package system employing an offset stacked configuration | DaeSik Choi, BumJoon Hong, Sang Ho Lee, Soo-San Park | 2011-01-18 |
| 7829986 | Integrated circuit package system with net spacer | Sang Ho Lee, Soo-San Park | 2010-11-09 |
| 7812435 | Integrated circuit package-in-package system with side-by-side and offset stacking | Soo-San Park, BumJoon Hong, Sang Ho Lee | 2010-10-12 |
| 7772683 | Stacked integrated circuit package-in-package system | Ki Youn Jang, Jong Wook Ju | 2010-08-10 |
| 7755180 | Integrated circuit package-in-package system | Choong Bin Yim, Hyeog Chan Kwon | 2010-07-13 |
| 7750454 | Stacked integrated circuit package system | Flynn Carson, BumJoon Hong, Seongmin Lee | 2010-07-06 |
| 7741154 | Integrated circuit package system with stacking module | Flynn Carson, BumJoon Hong, Seongmin Lee | 2010-06-22 |
| 7687897 | Mountable integrated circuit package-in-package system with adhesive spacing structures | Seongmin Lee, JoHyun Bae | 2010-03-30 |
| 7674640 | Stacked die package system | Myung Kil Lee, Hyun Uk Kim, Taebok Jung | 2010-03-09 |
| 7659609 | Integrated circuit package-in-package system with carrier interposer | BumJoon Hong, Sang Ho Lee, Soo-San Park | 2010-02-09 |
| 7652376 | Integrated circuit package system including stacked die | Soo-San Park, Hyeog Chan Kwon, Sang Ho Lee | 2010-01-26 |
| 7635913 | Stacked integrated circuit package-in-package system | OhSug Kim, Jong Wook Ju | 2009-12-22 |
| 7501697 | Integrated circuit package system | Choong Bin Yim, Hyeog Chan Kwon | 2009-03-10 |