Issued Patents All Time
Showing 51–56 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7498667 | Stacked integrated circuit package-in-package system | Gwang Kim, Juhyun Park | 2009-03-03 |
| 7456088 | Integrated circuit package system including stacked die | Soo-San Park, Hyeog Chan Kwon, Sang Ho Lee | 2008-11-25 |
| 7420269 | Stacked integrated circuit package-in-package system | Gwang Kim, Ju Hyun Park | 2008-09-02 |
| 7368319 | Stacked integrated circuit package-in-package system | Gwang Kim, Juhyun Park | 2008-05-06 |
| 7288835 | Integrated circuit package-in-package system | Choong Bin Yim, Hyeog Chan Kwon | 2007-10-30 |
| 7279785 | Stacked die package system | Myung Kil Lee, Hyun Uk Kim, Taebok Jung | 2007-10-09 |