Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9034693 | Integrated circuit package with open substrate and method of manufacturing thereof | Il Kwon Shim, Jian Li, Dario S. Filoteo, Jr. | 2015-05-19 |
| 8030783 | Integrated circuit package with open substrate | Il Kwon Shim, Jian Li, Dario S. Filoteo, Jr. | 2011-10-04 |
| 7626277 | Integrated circuit package with open substrate | Il Kwon Shim, Jian Li, Dario S. Filoteo, Jr. | 2009-12-01 |
| 7008820 | Chip scale package with open substrate | Il Kwon Shim, Jian Li, Dario S. Filoteo, Jr. | 2006-03-07 |