Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit packaging system with interlock and method of manufacture thereof

Integrated circuit packaging system with interlock and method of manufacture thereof

US Patent 8617933 · Granted Dec 31, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming an optical semiconductor package with2025
Side-solderable leadless package2025
Reliable semiconductor packages2025
Semiconductor device and method of forming substrate with 3-sided wettable flank2024
Side-solderable leadless package2023
Semiconductor device and method of forming mold degating structure for pre-molde2022
Semiconductor device and method of forming mold degating structure for pre-molde2022
Side-solderable leadless package2021
Semiconductor device and method of forming wafer level ground plane and power ri2020
Semiconductor device and method of forming PIP with inner known good die interco2020
Semiconductor device and method of forming PIP with inner known good die interco2020
Semiconductor device and method of forming package-on-package structure electric2018