Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8604596 | Integrated circuit packaging system with locking interconnects and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2013-12-10 |
| 8508026 | Integrated circuit packaging system with connection supports and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2013-08-13 |
| 8502357 | Integrated circuit packaging system with shaped lead and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2013-08-06 |
| 8502358 | Integrated circuit packaging system with multi-row leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2013-08-06 |
| 8482109 | Integrated circuit packaging system with dual connection and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2013-07-09 |
| 8455993 | Integrated circuit packaging system with multiple row leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2013-06-04 |
| 8420508 | Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2013-04-16 |
| 8421221 | Integrated circuit heat spreader stacking system | Dario S. Filoteo, Jr., Philip Lyndon Cablao | 2013-04-16 |
| 8415205 | Integrated circuit packaging system with lead interlocking mechanisms and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2013-04-09 |
| 8409922 | Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Henry Descalzo Bathan | 2013-04-02 |
| 8404524 | Integrated circuit packaging system with paddle molding and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2013-03-26 |
| 8395254 | Integrated circuit package system with heatspreader | Dario S. Filoteo, Jr., Leo A. Merilo, Philip Lyndon Cablao, Rachel Layda Abinan, Allan P. Ilagan | 2013-03-12 |
| 8334584 | Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2012-12-18 |
| 8241965 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Henry Descalzo Bathan, Flynn Carson, Zigmund Ramirez Camacho | 2012-08-14 |
| 8241956 | Semiconductor device and method of forming wafer level multi-row etched lead package | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo | 2012-08-14 |
| 8203201 | Integrated circuit packaging system with leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2012-06-19 |
| 8193037 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Dioscoro A. Merilo | 2012-06-05 |
| 8138595 | Integrated circuit packaging system with an intermediate pad and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2012-03-20 |
| 8138080 | Integrated circuit package system having interconnect stack and external interconnect | Dario S. Filoteo, Jr., Leo A. Merilo, Philip Lyndon Cablao, Rachel Layda Abinan, Allan P. Ilagan | 2012-03-20 |
| 8097935 | Quad flat package | Leo A. Merilo, Rachel Layda Abinan, Dario S. Filoteo, Jr. | 2012-01-17 |
| 8097496 | Method of forming quad flat package | Leo A. Merilo, Rachel Layda Abinan, Dario S. Filoteo, Jr. | 2012-01-17 |
| 8076184 | Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo | 2011-12-13 |
| 8026129 | Stacked integrated circuits package system with passive components | Philip Lyndon Cablao, Dario S. Filoteo, Jr., Leo A. Merilo, Rachel Layda Abinan, Allan P. Ilagan | 2011-09-27 |
| 8021931 | Direct via wire bonding and method of assembling the same | Dario S. Filoteo, Jr. | 2011-09-20 |
| 7786575 | Stacked die semiconductor device having circuit tape | Philip Lyndon Cablao, Dario S. Filoteo, Jr., Leo A. Merilo | 2010-08-31 |