Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit packaging system with side solderable leads and method of manufacture thereof

Integrated circuit packaging system with side solderable leads and method of manufacture thereof

US Patent 9048228 · Granted Jun 2, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming an optical semiconductor package with2025
Reliable semiconductor packages2025
Reliable semiconductor packages2025
Reliable semiconductor packages2024
Semiconductor device and method of forming interposer frame over semiconductor d2021
Semiconductor device and method of forming interposer frame over semiconductor d2020
Semiconductor device and method of forming Fo-WLCSP with recessed interconnect a2019
Integrated circuit packaging system with substrate and method of manufacture the2018
Semiconductor device and method of forming a package in-fan out package2018
Integrated circuit packaging system and method of manufacture thereof2018
Semiconductor device and method of forming interposer frame over semiconductor d2018
Package-on-package using through-hole via die on saw streets2017