Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

US Patent RE48408 · Granted Jan 26, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of stacking hybrid substrates with embedded elec2025
Semiconductor device and method of detecting semiconductor wafer centered on tap2025
Semiconductor device and method of forming hybrid substrate with uniform thickne2025
Semiconductor device and method to minimize stress on stack via2024
Learning-based 3D model creation apparatus and method2024
Semiconductor device and method of forming interposer with opening to contain se2023
Apparatus and method for guiding multi-view capture2022
Learning-based 3D model creation apparatus and method2022
Method and system for generating 3D image of character2021
Semiconductor device and method of forming sacrificial adhesive over contact pad2021
Semiconductor device and method to minimize stress on stack via2020
Camera auxiliary device for privacy protection and privacy protection method usi2020