Issued Patents All Time
Showing 101–125 of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8415206 | Integrated circuit packaging system with lead frame etching and method of manufacture thereof | — | 2013-04-09 |
| 8415205 | Integrated circuit packaging system with lead interlocking mechanisms and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu | 2013-04-09 |
| 8409922 | Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect | Dioscoro A. Merilo, Henry Descalzo Bathan, Emmanuel Espiritu | 2013-04-02 |
| 8404524 | Integrated circuit packaging system with paddle molding and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu | 2013-03-26 |
| 8399991 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2013-03-19 |
| 8389332 | Integrated circuit packaging system with isolated pads and method of manufacture thereof | Henry Descalzo Bathan, Lionel Chien Hui Tay, Jose Alvin Caparas | 2013-03-05 |
| 8389333 | Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die | — | 2013-03-05 |
| 8377750 | Integrated circuit packaging system with multiple row leads and method of manufacture thereof | Dioscoro A. Merilo, Henry Descalzo Bathan | 2013-02-19 |
| 8362601 | Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof | Henry Descalzo Bathan, Jeffrey D. Punzalan, Lionel Chien Hui Tay | 2013-01-29 |
| 8354742 | Method and apparatus for a package having multiple stacked die | Jairus Legaspi Pisigan, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2013-01-15 |
| 8344495 | Integrated circuit packaging system with interconnect and method of manufacture thereof | Philip Lyndon Cablao, Lionel Chien Hui Tay, Frederick R. Dahilig | 2013-01-01 |
| 8338233 | Method of manufacture of integrated circuit packaging system with stacked integrated circuit | Jairus Legaspi Pisigan, Henry Descalzo Bathan | 2012-12-25 |
| 8334584 | Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu | 2012-12-18 |
| 8334171 | Package system with a shielded inverted internal stacking module and method of manufacture thereof | Reza A. Pagaila, Henry Descalzo Bathan | 2012-12-18 |
| 8304921 | Integrated circuit packaging system with interconnect and method of manufacture thereof | Henry Descalzo Bathan, Allan P. Ilagan, Philip Lyndon Cablao | 2012-11-06 |
| 8304869 | Fan-in interposer on lead frame for an integrated circuit package on package system | Jairus Legaspi Pisigan, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2012-11-06 |
| 8304337 | Integrated circuit packaging system with bond wire pads and method of manufacture thereof | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2012-11-06 |
| 8283209 | Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps | Frederick R. Dahilig, Lionel Chien Hui Tay | 2012-10-09 |
| 8283250 | Semiconductor device and method of forming a conductive via-in-via structure | Lionel Chien Hui Tay, Jianmin Fang | 2012-10-09 |
| 8278148 | Integrated circuit package system with leads separated from a die paddle | Jeffrey D. Punzalan, Jairus Legaspi Pisigan, Lionel Chien Hui Tay | 2012-10-02 |
| 8273602 | Integrated circuit package system with integration port | Henry Descalzo Bathan, Lionel Chien Hui Tay, Jose Alvin Caparas | 2012-09-25 |
| 8269324 | Integrated circuit package system with chip on lead | Arnel Senosa Trasporto, Lionel Chien Hui Tay, Jose Alvin Caparas | 2012-09-18 |
| 8258614 | Integrated circuit package system with package integration | Jairus Legaspi Pisigan, Abelardo Jr. Hadap Advincula, Lionel Chien Hui Tay | 2012-09-04 |
| 8258609 | Integrated circuit package system with lead support | Henry Descalzo Bathan, Jose Alvin Caparas, Arnel Senosa Trasporto | 2012-09-04 |
| 8252666 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2012-08-28 |