Issued Patents All Time
Showing 126–150 of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8252634 | Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof | Jose Alvin Caparas, Lionel Chien Hui Tay | 2012-08-28 |
| 8241965 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Henry Descalzo Bathan, Flynn Carson, Emmanuel Espiritu | 2012-08-14 |
| 8241954 | Wafer level die integration and method | Dioscoro A. Merilo, Lionel Chien Hui Tay, Frederick R. Dahilig | 2012-08-14 |
| 8241956 | Semiconductor device and method of forming wafer level multi-row etched lead package | Henry Descalzo Bathan, Dioscoro A. Merilo, Emmanuel Espiritu | 2012-08-14 |
| 8236607 | Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2012-08-07 |
| 8227910 | Apparatus for thermally enhanced semiconductor package | Reza A. Pagaila, Byung Tai Do | 2012-07-24 |
| 8216883 | Method for manufacturing semiconductor package system with die support pad | Dioscoro A. Merilo, Lionel Chien Hui Tay | 2012-07-10 |
| 8212342 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Dioscoro A. Merilo, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2012-07-03 |
| 8207597 | Integrated circuit package system with flashless leads | Jeffrey D. Punzalan, Henry Descalzo Bathan, Il Kwon Shim | 2012-06-26 |
| 8203214 | Integrated circuit package in package system with adhesiveless package attach | Henry Descalzo Bathan, Lionel Chien Hui Tay, Jeffrey D. Punzalan | 2012-06-19 |
| 8203220 | Integrated circuit package system with multiple device units and method for manufacturing thereof | Lionel Chien Hui Tay, Jeffrey D. Punzalan, Arnel Senosa Trasporto | 2012-06-19 |
| 8203201 | Integrated circuit packaging system with leads and method of manufacture thereof | Emmanuel Espiritu, Henry Descalzo Bathan | 2012-06-19 |
| 8193037 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Henry Descalzo Bathan, Dioscoro A. Merilo, Emmanuel Espiritu | 2012-06-05 |
| 8174098 | Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via | Lionel Chien Hui Tay, Govindiah G. Badakere | 2012-05-08 |
| 8148825 | Integrated circuit package system with leadfinger | Lionel Chien Hui Tay, Jairus Legaspi Pisigan, Jeffrey D. Punzalan | 2012-04-03 |
| 8148208 | Integrated circuit package system with leaded package and method for manufacturing thereof | Jairus Legaspi Pisigan, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2012-04-03 |
| 8138586 | Integrated circuit package system with multi-planar paddle | Arnel Senosa Trasporto, Sze Min Wong, Henry Descalzo Bathan | 2012-03-20 |
| 8138595 | Integrated circuit packaging system with an intermediate pad and method of manufacture thereof | Emmanuel Espiritu, Henry Descalzo Bathan | 2012-03-20 |
| 8138027 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2012-03-20 |
| 8134242 | Integrated circuit package system with concave terminal | Arnel Senosa Trasporto, Reza A. Pagaila, Lionel Chien Hui Tay | 2012-03-13 |
| 8129827 | Integrated circuit package system with package encapsulation having recess | Jeffrey D. Punzalan, Jairus Legaspi Pisigan, Abelardo Jr Hadap Advincula | 2012-03-06 |
| 8120150 | Integrated circuit package system with dual connectivity | Guruprasad Badakere Govindaiah, Jeffrey D. Punzalan, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2012-02-21 |
| 8120149 | Integrated circuit package system | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2012-02-21 |
| 8120156 | Integrated circuit package system with die on base package | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2012-02-21 |
| 8115305 | Integrated circuit package system with thin profile | Henry Descalzo Bathan, Abelardo Hadap Advincula, Lionel Chien Hui Tay | 2012-02-14 |