Issued Patents All Time
Showing 176–200 of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7977778 | Integrated circuit package system with interference-fit feature | Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-07-12 |
| 7977779 | Mountable integrated circuit package-in-package system | Arnel Senosa Trasporto, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-07-12 |
| 7977780 | Multi-layer package-on-package system | Lionel Chien Hui Tay, Jairus Legaspi Pisigan | 2011-07-12 |
| 7964450 | Wirebondless wafer level package with plated bumps and interconnects | Dioscoro A. Merilo, Lionel Chien Hui Tay, Jose Alvin Caparas | 2011-06-21 |
| 7960815 | Leadframe design for QFN package with top terminal leads | Henry Descalzo Bathan, Jose Alvin Caparas, Lionel Chien Hui Tay | 2011-06-14 |
| 7936053 | Integrated circuit package system with lead structures including a dummy tie bar | Jeffrey D. Punzalan, Henry Descalzo Bathan, Il Kwon Shim | 2011-05-03 |
| 7932130 | Method for forming an etched recess package on package system | Henry Descalzo Bathan, Lionel Chien Hui Tay, Jairus Legaspi Pisigan | 2011-04-26 |
| 7919850 | Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof | Arnel Senosa Trasporto, Lionel Chien Hui Tay, Abelardo Hadap Advincula | 2011-04-05 |
| 7919848 | Integrated circuit package system with multiple devices | Henry Descalzo Bathan, Abelardo Jr Hadap Advincula, Lionel Chien Hui Tay | 2011-04-05 |
| 7919360 | Integrated circuit packaging system with circuitry stacking and method of manufacture thereof | Jose Alvin Caparas, Arnel Senosa Trasporto | 2011-04-05 |
| 7915724 | Integrated circuit packaging system with base structure device | Jong-Woo Ha, Koo Hong Lee, Soo Won Lee, Juhyun Park, Jeffrey D. Punzalan +2 more | 2011-03-29 |
| 7915716 | Integrated circuit package system with leadframe array | Jairus Legaspi Pisigan, Jeffrey D. Punzalan, Lionel Chien Hui Tay | 2011-03-29 |
| 7911067 | Semiconductor package system with die support pad | Dioscoro A. Merilo, Lionel Chien Hui Tay | 2011-03-22 |
| 7911040 | Integrated circuit package with improved connections | Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-03-22 |
| 7901996 | Integrated circuit package system with interconnection support and method of manufacture thereof | Henry Descalzo Bathan, Il Kwon Shim, Jeffrey D. Punzalan | 2011-03-08 |
| 7888181 | Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die | Lionel Chien Hui Tay, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2011-02-15 |
| 7871863 | Integrated circuit package system with multiple molding | Jose Alvin Caparas, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-01-18 |
| 7868471 | Integrated circuit package-in-package system with leads | Arnel Senosa Trasporto, Jeffrey D. Punzalan, Abelardo Hadap Advincula | 2011-01-11 |
| 7855444 | Mountable integrated circuit package system with substrate | Albelardo Jr. Hadap Advincula, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2010-12-21 |
| 7851246 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Lionel Chien Hui Tay, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2010-12-14 |
| 7842607 | Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via | Lionel Chien Hui Tay, Guruprasad G. Badakere | 2010-11-30 |
| 7838395 | Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same | Guruprasad G. Badakere, Lionel Chien Hui Tay | 2010-11-23 |
| 7790576 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2010-09-07 |
| 7785929 | Mountable integrated circuit package system with exposed external interconnects | Abelardo Jr. Hadap Advincula, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2010-08-31 |
| 7777310 | Integrated circuit package system with integral inner lead and paddle | Jeffrey D. Punzalan, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2010-08-17 |