Issued Patents All Time
Showing 201–220 of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7777354 | Integrated circuit package system with leaded package | Jairus Legaspi Pisigan, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2010-08-17 |
| 7763493 | Integrated circuit package system with top and bottom terminals | Lionel Chien Hui Tay, Henry Descalzo Bathan | 2010-07-27 |
| 7759806 | Integrated circuit package system with multiple device units | Lionel Chien Hui Tay, Jeffrey D. Punzalan, Arnel Senosa Trasporto | 2010-07-20 |
| 7750451 | Multi-chip package system with multiple substrates | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2010-07-06 |
| 7732901 | Integrated circuit package system with isloated leads | Henry Descalzo Bathan, Abelardo Hadap Advincula, Lionel Chien Hui Tay | 2010-06-08 |
| 7723840 | Integrated circuit package system with contoured die | Henry Descalzo Bathan, Lionel Chien Hui Tay | 2010-05-25 |
| 7714419 | Integrated circuit package system with shielding | Lionel Chien Hui Tay, Henry Descalzo Bathan, Guruprasad Badakere Govindaiah | 2010-05-11 |
| 7691674 | Integrated circuit packaging system with stacked device and method of manufacturing thereof | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2010-04-06 |
| 7671463 | Integrated circuit package system with ground ring | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2010-03-02 |
| 7563647 | Integrated circuit package system with interconnect support | Henry Descalzo Bathan, Il Kwon Shim, Jeffrey D. Punzalan | 2009-07-21 |
| 7545032 | Integrated circuit package system with stiffener | Henry Descalzo Bathan, Antonio B. Dimaano, Jr., Jeffrey D. Punzalan | 2009-06-09 |
| 7541221 | Integrated circuit package system with leadfinger support | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2009-06-02 |
| 7517733 | Leadframe design for QFN package with top terminal leads | Henry Descalzo Bathan, Jose Alvin Caparas, Lionel Chien Hui Tay | 2009-04-14 |
| 7479409 | Integrated circuit package with elevated edge leadframe | Henry Descalzo Bathan, Jose Alvin Caparas, Jeffrey D. Punzalan | 2009-01-20 |
| 7449369 | Integrated circuit package system with multiple molding | Jose Alvin Caparas, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2008-11-11 |
| 7420265 | Integrated circuit package system with integrated circuit support | Henry Descalzo Bathan, Il Kwon Shim, Jeffrey D. Punzalan | 2008-09-02 |
| 7400049 | Integrated circuit package system with heat sink | Il Kwon Shim, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2008-07-15 |
| 7365417 | Overhang integrated circuit package system | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2008-04-29 |
| 7274089 | Integrated circuit package system with adhesive restraint | Jeffrey D. Punzalan, Il Kwon Shim, Henry Descalzo Bathan | 2007-09-25 |
| 6833287 | System for semiconductor package with stacked dies | Hyeong Hur, Henry Descalzo Bathan | 2004-12-21 |