Issued Patents All Time
Showing 151–175 of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8115287 | Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof | Abelardo Jr. Hadap Advincula, Erwin Aguas Sangalang, Lionel Chien Hui Tay | 2012-02-14 |
| 8110440 | Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2012-02-07 |
| 8106502 | Integrated circuit packaging system with plated pad and method of manufacture thereof | Henry Descalzo Bathan, Jairus Legaspi Pisigan, Lionel Chien Hui Tay | 2012-01-31 |
| 8106499 | Integrated circuit packaging system with a dual substrate package and method of manufacture thereof | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2012-01-31 |
| 8105915 | Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers | Dioscoro A. Merilo, Jairus Legaspi Pisigan, Frederick R. Dahilig | 2012-01-31 |
| 8097943 | Semiconductor device and method of forming wafer level ground plane and power ring | Guruprasad G. Badakere, Lionel Chien Hui Tay | 2012-01-17 |
| 8080867 | Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof | Jairus Legaspi Pisigan, Henry Descalzo Bathan | 2011-12-20 |
| 8076184 | Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die | Emmanuel Espiritu, Henry Descalzo Bathan, Dioscoro A. Merilo | 2011-12-13 |
| 8072079 | Through hole vias at saw streets including protrusions or recesses for interconnection | Reza A. Pagaila, Lionel Chien Hui Tay, Byung Tai Do | 2011-12-06 |
| 8072047 | Integrated circuit package system with shield and tie bar | Lionel Chien Hui Tay, Henry Descalzo Bathan, Guruprasad Badakere Govindaiah | 2011-12-06 |
| 8067825 | Integrated circuit package system with multiple die | Abelardo Jr. Hadap Advincula, Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2011-11-29 |
| 8062934 | Integrated circuit package system with ground bonds | Jeffrey D. Punzalan, Henry Descalzo Bathan | 2011-11-22 |
| 8043894 | Integrated circuit package system with redistribution layer | Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-10-25 |
| 8039947 | Integrated circuit package system with different mold locking features | Jeffrey D. Punzalan, Henry Descalzo Bathan | 2011-10-18 |
| 8039302 | Semiconductor package and method of forming similar structure for top and bottom bonding pads | Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-10-18 |
| 8035207 | Stackable integrated circuit package system with recess | Henry Descalzo Bathan, Jose Alvin Caparas, Lionel Chien Hui Tay | 2011-10-11 |
| 8022539 | Integrated circuit packaging system with increased connectivity and method of manufacture thereof | Frederick R. Dahilig, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-09-20 |
| 8022514 | Integrated circuit package system with leadfinger support | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-09-20 |
| 8021907 | Method and apparatus for thermally enhanced semiconductor package | Reza A. Pagaila, Byung Tai Do | 2011-09-20 |
| 8003443 | Non-leaded integrated circuit package system with multiple ground sites | Jeffrey D. Punzalan, Byung Tai Do, Henry Descalzo Bathan | 2011-08-23 |
| 7998790 | Integrated circuit packaging system with isolated pads and method of manufacture thereof | Henry Descalzo Bathan, Lionel Chien Hui Tay, Jose Alvin Caparas | 2011-08-16 |
| 7994629 | Leadless integrated circuit packaging system and method of manufacture thereof | — | 2011-08-09 |
| 7993939 | Integrated circuit package system with laminate base | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-08-09 |
| 7977782 | Integrated circuit package system with dual connectivity | Jairus Legaspi Pisigan, Jose Alvin Caparas, Lionel Chien Hui Tay | 2011-07-12 |
| 7977579 | Multiple flip-chip integrated circuit package system | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-07-12 |