ES

Erwin Aguas Sangalang

SC Stats Chippac: 2 patents #228 of 425Top 55%
📍 Singapore, SG: #4,165 of 13,971 inventorsTop 30%
Overall (All Time): #2,075,408 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8492887 Integrated circuit packaging system with leadframe and method of manufacture thereof Jayby Agno, Dexter Anonuevo, Ramona Damalerio 2013-07-23
8115287 Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof Zigmund Ramirez Camacho, Abelardo Jr. Hadap Advincula, Lionel Chien Hui Tay 2012-02-14