Issued Patents All Time
Showing 76–100 of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8617933 | Integrated circuit packaging system with interlock and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu, Dioscoro A. Merilo | 2013-12-31 |
| 8604596 | Integrated circuit packaging system with locking interconnects and method of manufacture thereof | Emmanuel Espiritu, Henry Descalzo Bathan | 2013-12-10 |
| 8592252 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2013-11-26 |
| 8586422 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Henry Descalzo Bathan, Lionel Chien Hui Tay, Amel Senosa Trasporto | 2013-11-19 |
| 8569872 | Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation | Henry Descalzo Bathan, Il Kwon Shim, Philip Lyndon Cablao, Jose Alvin Caparas | 2013-10-29 |
| 8558369 | Integrated circuit packaging system with interconnects and method of manufacture thereof | Henry Descalzo Bathan, Frederick Rodriguez Gahilig, Jairus Legaspi Pisigan | 2013-10-15 |
| 8557639 | Apparatus for thermally enhanced semiconductor package | Reza A. Pagaila, Byung Tai Do | 2013-10-15 |
| 8546189 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Lionel Chien Hui Tay, Henry Descalzo Bathan, Jeffrey D. Punzalan, Dioscoro A. Merilo | 2013-10-01 |
| 8536690 | Integrated circuit packaging system with cap layer and method of manufacture thereof | Lionel Chien Hui Tay, Henry Descalzo Bathan, Guruprasad Badakere Govindaiah | 2013-09-17 |
| 8518749 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Lionel Chien Hui Tay, Dioscoro A. Merilo | 2013-08-27 |
| 8513801 | Integrated circuit package system | Lionel Chien Hui Tay, Jairus Legaspi Pisigan | 2013-08-20 |
| 8508026 | Integrated circuit packaging system with connection supports and method of manufacture thereof | Emmanuel Espiritu, Henry Descalzo Bathan | 2013-08-13 |
| 8502376 | Wirebondless wafer level package with plated bumps and interconnects | Dioscoro A. Merilo, Lionel Chien Hui Tay, Jose Alvin Caparas | 2013-08-06 |
| 8502371 | Integrated circuit package system with extended corner leads | Lionel Chien Hui Tay, Jairus Legaspi Pisigan, Henry Descalzo Bathan | 2013-08-06 |
| 8502358 | Integrated circuit packaging system with multi-row leads and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu | 2013-08-06 |
| 8502357 | Integrated circuit packaging system with shaped lead and method of manufacture thereof | Emmanuel Espiritu, Henry Descalzo Bathan | 2013-08-06 |
| 8493748 | Packaging system with hollow package and method for the same | Henry Descalzo Bathan, Lionel Chien Hui Tay, Jeffrey D. Punzalan | 2013-07-23 |
| 8482109 | Integrated circuit packaging system with dual connection and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu | 2013-07-09 |
| 8455993 | Integrated circuit packaging system with multiple row leads and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu | 2013-06-04 |
| 8455988 | Integrated circuit package system with bumped lead and nonbumped lead | Jose Alvin Caparas | 2013-06-04 |
| 8421198 | Integrated circuit package system with external interconnects at high density | Lionel Chien Hui Tay, Abelardo Hadap Advincula | 2013-04-16 |
| 8420508 | Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu | 2013-04-16 |
| 8420448 | Integrated circuit packaging system with pads and method of manufacture thereof | — | 2013-04-16 |
| 8420447 | Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof | Lionel Chien Hui Tay, Henry Descalzo Bathan | 2013-04-16 |
| 8415778 | Non-leaded integrated circuit package system with multiple ground sites | Jeffrey D. Punzalan, Byung Tai Do, Henry Descalzo Bathan | 2013-04-09 |