Issued Patents All Time
Showing 26–50 of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9202793 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, JunMo Koo, Bartholomew Liao | 2015-12-01 |
| 9202777 | Semiconductor package system with cut multiple lead pads | Lionel Chien Hui Tay, Seng Guan Chow | 2015-12-01 |
| 9177832 | Semiconductor device and method of forming a reconfigured stackable wafer level package with vertical interconnect | — | 2015-11-03 |
| 9142514 | Semiconductor device and method of forming wafer level die integration | Dioscoro A. Merilo, Lionel Chien Hui Tay, Frederick R. Dahilig | 2015-09-22 |
| 9142531 | Integrated circuit packaging system with plated leads and method of manufacture thereof | Henry Descalzo Bathan, Lionel Chien Hui Tay | 2015-09-22 |
| 9129971 | Semiconductor device with bump interconnection | Lionel Chien Hui Tay, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2015-09-08 |
| 9076737 | Integrated circuit packaging system with bumps and method of manufacture thereof | Emmanuel Espiritu, Jose Alvin Caparas, Lionel Chien Hui Tay | 2015-07-07 |
| 9059151 | Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu | 2015-06-16 |
| 9059074 | Integrated circuit package system with planar interconnect | Lionel Chien Hui Tay, Henry Descalzo Bathan, Abelardo Jr. Hadap Advincula | 2015-06-16 |
| 9035440 | Integrated circuit packaging system with a lead and method of manufacture thereof | Emmanuel Espiritu, Elizar Andres, Henry Descalzo Bathan | 2015-05-19 |
| 9034692 | Integrated circuit packaging system with a flip chip and method of manufacture thereof | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2015-05-19 |
| 9006031 | Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps | Henry Descalzo Bathan, Emmanuel Espiritu | 2015-04-14 |
| 8993376 | Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die | Emmanuel Espiritu, Henry Descalzo Bathan, Dioscoro A. Merilo | 2015-03-31 |
| 8957515 | Integrated circuit package system with array of external interconnects | Henry Descalzo Bathan, Abelardo Jr. Hadap Advincula, Lionel Chien Hui Tay | 2015-02-17 |
| 8941219 | Etched recess package on package system | Henry Descalzo Bathan, Lionel Chien Hui Tay, Jairus Legaspi Pisigan | 2015-01-27 |
| 8940636 | Through hole vias at saw streets including protrusions or recesses for interconnection | Reza A. Pagaila, Lionel Chien Hui Tay, Byung Tai Do | 2015-01-27 |
| 8937393 | Integrated circuit package system with device cavity | Henry Descalzo Bathan, Lionel Chien Hui Tay, Frederick R. Dahilig | 2015-01-20 |
| 8936971 | Integrated circuit packaging system with die paddles and method of manufacture thereof | Emmanuel Espiritu, Henry Descalzo Bathan | 2015-01-20 |
| 8921161 | Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die | — | 2014-12-30 |
| 8921983 | Semiconductor package and method of forming similar structure for top and bottom bonding pads | Lionel Chien Hui Tay, Henry Descalzo Bathan | 2014-12-30 |
| 8912046 | Integrated circuit packaging system with lead frame and method of manufacture thereof | Emmanuel Espiritu, Henry Descalzo Bathan | 2014-12-16 |
| 8890328 | Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers | Dioscoro A. Merilo, Jairus Legaspi Pisigan, Frederick R. Dahilig | 2014-11-18 |
| 8884418 | Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps | Frederick R. Dahilig, Lionel Chien Hui Tay | 2014-11-11 |
| 8872320 | Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2014-10-28 |
| 8866248 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2014-10-21 |