MK

Marcos Karnezos

CH Chippac: 43 patents #1 of 42Top 3%
SC Stats Chippac: 13 patents #69 of 425Top 20%
SI Signetics: 3 patents #5 of 93Top 6%
HP HP: 3 patents #1,644 of 7,018Top 25%
A- A-Sat: 2 patents #19 of 49Top 40%
VA Varian: 1 patents #283 of 684Top 45%
📍 Palo Alto, CA: #218 of 9,675 inventorsTop 3%
🗺 California: #4,640 of 386,348 inventorsTop 2%
Overall (All Time): #31,247 of 4,157,543Top 1%
68
Patents All Time

Issued Patents All Time

Showing 51–68 of 68 patents

Patent #TitleCo-InventorsDate
6933598 Semiconductor stacked multi-package module having inverted second package and electrically shielded first package 2005-08-23
6906416 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package 2005-06-14
6838761 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield 2005-01-04
6828220 Flip chip-in-leadframe package and process Rajendra D. Pendse, Walter A. Bush, Jr. 2004-12-07
6614123 Plastic ball grid array package with integral heatsink TaeKeun Lee, Flynn Carson 2003-09-02
6549413 Tape ball grid array semiconductor package structure and assembly process Yong-Bae Kim 2003-04-15
6395582 Methods for forming ground vias in semiconductor packages Ju Yung Sohn, Seung Ryul Ryu 2002-05-28
6373131 TBGA semiconductor package 2002-04-16
6326678 Molded plastic package with heat sink and enhanced electrical performance S. C. Chang, Edward Combs, John R. Fahey 2001-12-04
6323065 Methods for manufacturing ball grid array assembly semiconductor packages 2001-11-27
6020637 Ball grid array semiconductor package 2000-02-01
5843808 Structure and method for automated assembly of a tab grid array package 1998-12-01
5409865 Process for assembling a TAB grid array package for an integrated circuit 1995-04-25
5397921 Tab grid array 1995-03-14
5065280 Flex interconnect module Ravindhar K. Kaw, Lawrence R. Hanlon, Farid Matta 1991-11-12
4862490 Vacuum windows for soft x-ray machines Randal S. Jones 1989-08-29
4813129 Interconnect structure for PC boards and integrated circuits 1989-03-21
4632871 Anodic bonding method and apparatus for X-ray masks Howard H. Nakanos, Armand P. Neukermans 1986-12-30