Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11969028 | Brassiere for radiation therapy | Ki Chang Keum, Seung Kwon Ahn, Sam Ju Cho | 2024-04-30 |
| D971075 | Pod for plant cultivator | Kyukwan Choi, Minsub Kim | 2022-11-29 |
| D961450 | Pod for plant cultivator | Kyukwan Choi, Minsub Kim | 2022-08-23 |
| 10243917 | Method and apparatus for calculating distance in contents delivery network | Seung Ho Ryu, Seok-Chan Lee | 2019-03-26 |
| 8602480 | Sunvisor having damper device | Deok-Rae Kim | 2013-12-10 |
| 8318969 | Alignment material for liquid crystal display device of vertical alignment mode and method of preparing the same | Jin Wook Choi, Eung jae Park, Jae Cheol PARK | 2012-11-27 |
| 8299304 | Alignment material for liquid crystal display device of vertical alignment mode and method of preparing the same | Jin Wook Choi, Dal bong Seo, Jae Cheol PARK | 2012-10-30 |
| 7306002 | System and method for wet cleaning a semiconductor wafer | Jungyup Kim, Yong Ho Lee, In-Kwon Jeong | 2007-12-11 |
| 7258124 | Apparatus and method for treating surfaces of semiconductor wafers using ozone | In-Kwon Jeong, Jungyup Kim | 2007-08-21 |
| 7071113 | Process for removal of photoresist mask used for making vias in low K carbon-doped silicon oxide dielectric material, and for removal of etch residues from formation of vias and removal of photoresist mask | Philippe Schoenborn | 2006-07-04 |
| 7051743 | Apparatus and method for cleaning surfaces of semiconductor wafers using ozone | In-Kwon Jeong, Jungyup Kim | 2006-05-30 |
| 7022193 | Apparatus and method for treating surfaces of semiconductor wafers using ozone | In-Kwon Jeong, Jungyup Kim | 2006-04-04 |
| 6836929 | Accessary tool mounting device for vacuum cleaner | — | 2005-01-04 |
| 6794314 | Method of forming ultrathin oxide layer | Ivo Raaijmakers, Marko Tuominen, Suvi Haukka | 2004-09-21 |
| 6723653 | Process for reducing defects in copper-filled vias and/or trenches formed in porous low-k dielectric material | — | 2004-04-20 |
| 6673721 | PROCESS FOR REMOVAL OF PHOTORESIST MASK USED FOR MAKING VIAS IN LOW K CARBON-DOPED SILICON OXIDE DIELECTRIC MATERIAL, AND FOR REMOVAL OF ETCH RESIDUES FROM FORMATION OF VIAS AND REMOVAL OF PHOTORESIST MASK | Philippe Schoenborn | 2004-01-06 |
| 6559048 | Method of making a sloped sidewall via for integrated circuit structure to suppress via poisoning | Philippe Schoenborn, Kai Zhang | 2003-05-06 |
| 6549413 | Tape ball grid array semiconductor package structure and assembly process | Marcos Karnezos | 2003-04-15 |
| 6503840 | Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning | Wilbur G. Catabay, Wei-Jen Hsia, Hong-Qiang Lu, Kiran Kumar, Kai Zhang +2 more | 2003-01-07 |
| 6492283 | Method of forming ultrathin oxide layer | Ivo Raaijmakers, Marko Tuominen, Suvi Haukka | 2002-12-10 |