Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7646077 | Methods and structure for forming copper barrier layers integral with semiconductor substrates structures | Peter A. Burke, Wilbur G. Catabay | 2010-01-12 |
| 7427563 | Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures | Peter A. Burke, Wilbur G. Catabay | 2008-09-23 |
| 7393780 | Dual layer barrier film techniques to prevent resist poisoning | Wei-Jen Hsia, Wilbur G. Catabay | 2008-07-01 |
| 7071094 | Dual layer barrier film techniques to prevent resist poisoning | Wei-Jen Hsia, Wilbur G. Catabay | 2006-07-04 |
| 6955937 | Carbon nanotube memory cell for integrated circuit structure with removable side spacers to permit access to memory cell and process for forming such memory cell | Peter A. Burke, Sey-Shing Sun | 2005-10-18 |
| 6939800 | Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures | Peter A. Burke, Wilbur G. Catabay | 2005-09-06 |
| 6812134 | Dual layer barrier film techniques to prevent resist poisoning | Wei-Jen Hsia, Wilbur G. Catabay | 2004-11-02 |
| 6774057 | Method and structure for forming dielectric layers having reduced dielectric constants | Wei-Jen Hsia, Wilbur G. Catabay | 2004-08-10 |
| 6559033 | Processing for forming integrated circuit structure with low dielectric constant material between closely spaced apart metal lines | John Hu, Kai Zhang, Senthil Arthanari | 2003-05-06 |
| 6503840 | Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning | Wilbur G. Catabay, Wei-Jen Hsia, Yong-Bae Kim, Kiran Kumar, Kai Zhang +2 more | 2003-01-07 |