Issued Patents All Time
Showing 1–25 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043968 | Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures | Hao Cui, Peter A. Burke | 2011-10-25 |
| 7956401 | Bi-axial texturing of high-K dielectric films to reduce leakage currents | Wai Lo, Sey-Shing Sun | 2011-06-07 |
| 7728433 | Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures | Hao Cui, Peter A. Burke | 2010-06-01 |
| 7675177 | Forming copper interconnects with Sn coatings | Hongqiang Lu, Byung Sung Kwak | 2010-03-09 |
| 7646077 | Methods and structure for forming copper barrier layers integral with semiconductor substrates structures | Hong-Qiang Lu, Peter A. Burke | 2010-01-12 |
| 7619272 | Bi-axial texturing of high-K dielectric films to reduce leakage currents | Wai Lo, Sey-Shing Sun | 2009-11-17 |
| 7427563 | Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures | Hong-Qiang Lu, Peter A. Burke | 2008-09-23 |
| 7413984 | Multi-step process for forming a barrier film for use in copper layer formation | Zhihai Wang, Ping Li | 2008-08-19 |
| 7393780 | Dual layer barrier film techniques to prevent resist poisoning | Hong-Qiang Lu, Wei-Jen Hsia | 2008-07-01 |
| 7312127 | Incorporating dopants to enhance the dielectric properties of metal silicates | Wai Lo, Verne Hornback, Wei-Jen Hsia, Sey-Shing Sun | 2007-12-25 |
| 7285145 | Electro chemical mechanical polishing method and device for planarizing semiconductor surfaces | Mei Zhu | 2007-10-23 |
| 7276441 | Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures | Hao Cui, Peter A. Burke | 2007-10-02 |
| 7259462 | Interconnect dielectric tuning | Wai Lo, Hong Lin, Shiqun Gu, Zhihai Wang, Wei-Jen Hsia | 2007-08-21 |
| 7229923 | Multi-step process for forming a barrier film for use in copper layer formation | Zhihai Wang, Ping Li | 2007-06-12 |
| 7220362 | Planarization with reduced dishing | Wei-Jen Hsia, Hao Cui | 2007-05-22 |
| 7081406 | Interconnect dielectric tuning | Wai Lo, Hong Lin, Shiqun Gu, Zhihai Wang, Wei-Jen Hsia | 2006-07-25 |
| 7071094 | Dual layer barrier film techniques to prevent resist poisoning | Hong-Qiang Lu, Wei-Jen Hsia | 2006-07-04 |
| 7064062 | Incorporating dopants to enhance the dielectric properties of metal silicates | Wai Lo, Verne Hornback, Wei-Jen Hsia, Sey-Shing Sun | 2006-06-20 |
| 7029591 | Planarization with reduced dishing | Wei-Jen Hsia, Hao Cui | 2006-04-18 |
| 6939800 | Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures | Hong-Qiang Lu, Peter A. Burke | 2005-09-06 |
| 6935933 | Viscous electropolishing system | Valeriy Sukharev | 2005-08-30 |
| 6930056 | Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for integrated circuit structure | Wei-Jen Hsia | 2005-08-16 |
| 6905909 | Ultra low dielectric constant thin film | Hao Cui, Peter A. Burke | 2005-06-14 |
| 6884720 | Forming copper interconnects with Sn coatings | Hongqiang Lu, Byung Sung Kwak | 2005-04-26 |
| 6881664 | Process for planarizing upper surface of damascene wiring structure for integrated circuit structures | Richard Schinella, Zhihai Wang, Wei-Jen Hsia | 2005-04-19 |