Issued Patents All Time
Showing 26–50 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6875693 | Via and metal line interface capable of reducing the incidence of electro-migration induced voids | Charles E. May | 2005-04-05 |
| 6858531 | Electro chemical mechanical polishing method | Mei Zhu | 2005-02-22 |
| 6812134 | Dual layer barrier film techniques to prevent resist poisoning | Hong-Qiang Lu, Wei-Jen Hsia | 2004-11-02 |
| 6800940 | Low k dielectric composite layer for integrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning | Richard Schinella | 2004-10-05 |
| 6794756 | Integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines | Weidan Li, Wei-Jen Hsia | 2004-09-21 |
| 6790784 | Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for intergrated circuit structure | Wei-Jen Hsia | 2004-09-14 |
| 6777807 | Interconnect integration | Valeriy Sukharev, Hongqiang Lu | 2004-08-17 |
| 6774057 | Method and structure for forming dielectric layers having reduced dielectric constants | Hong-Qiang Lu, Wei-Jen Hsia | 2004-08-10 |
| 6767832 | In situ liner barrier | Kiran Kumar, Zhihai Wang, Kai Zhang | 2004-07-27 |
| 6756674 | Low dielectric constant silicon oxide-based dielectric layer for integrated circuit structures having improved compatibility with via filler materials, and method of making same | Wei-Jen Hsia, Weidan Li, Joe W. Zhao | 2004-06-29 |
| 6734560 | Diamond barrier layer | Zhihai Wang | 2004-05-11 |
| 6727177 | Multi-step process for forming a barrier film for use in copper layer formation | Zhihai Wang, Ping Li | 2004-04-27 |
| 6686272 | Anti-reflective coatings for use at 248 nm and 193 nm | Sang-Yun Lee, Masaichi Eda, Hongqiang Lu, Wei-Jen Hsia, Hiroaki Takikawa +1 more | 2004-02-03 |
| 6613665 | Process for forming integrated circuit structure comprising layer of low k dielectric material having antireflective properties in an upper surface | Wei-Jen Hsia | 2003-09-02 |
| 6537896 | Process for treating porous low k dielectric material in damascene structure to form a non-porous dielectric diffusion barrier on etched via and trench surfaces in the porous low k dielectric material | Wei-Jen Hsia | 2003-03-25 |
| 6528423 | PROCESS FOR FORMING COMPOSITE OF BARRIER LAYERS OF DIELECTRIC MATERIAL TO INHIBIT MIGRATION OF COPPER FROM COPPER METAL INTERCONNECT OF INTEGRATED CIRCUIT STRUCTURE INTO ADJACENT LAYER OF LOW K DIELECTRIC MATERIAL | Wei-Jen Hsia | 2003-03-04 |
| 6518193 | Substrate processing system | Kiran Kumar, Zhihai Wang, Rudy Rios, Richard Schinella | 2003-02-11 |
| 6503840 | Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning | Wei-Jen Hsia, Hong-Qiang Lu, Yong-Bae Kim, Kiran Kumar, Kai Zhang +2 more | 2003-01-07 |
| 6492731 | Composite low dielectric constant film for integrated circuit structure | Wei-Jen Hsia, Kai Zhang | 2002-12-10 |
| 6472314 | Diamond barrier layer | Zhihai Wang | 2002-10-29 |
| 6423630 | Process for forming low K dielectric material between metal lines | Wei-Jen Hsia, Dung-Ching Perng | 2002-07-23 |
| 6423628 | Method of forming integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines | Weidan Li, Wei-Jen Hsia | 2002-07-23 |
| 6420277 | Process for inhibiting crack formation in low dielectric constant dielectric films of integrated circuit structure | Wei-Jen Hsia, Hong Qiang | 2002-07-16 |
| 6391795 | Low k dielectric composite layer for intergrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning | Richard Schinella | 2002-05-21 |
| 6368979 | Process for forming trenches and vias in layers of low dielectric constant carbon-doped silicon oxide dielectric material of an integrated circuit structure | Zhihai Wang, Joe W. Zhao | 2002-04-09 |