| 9087945 |
Nanowires, nanowire junctions, and methods of making the same |
Vijay Pal Singh, Suresh K S Rajaputra |
2015-07-21 |
|
| 7601643 |
Arrangement and method for fabricating a semiconductor wafer |
— |
2009-10-13 |
$11,591,000 |
| 7582566 |
Method for redirecting void diffusion away from vias in an integrated circuit design |
Derryl D. J. Allman, Hemanshu Bhatt, Peter A. Burke, Byung Sung Kwak, Sey-Shing Sun +2 more |
2009-09-01 |
$5,881,000 |
| 7436040 |
Method and apparatus for diverting void diffusion in integrated circuit conductors |
Derryl D. J. Allman, Hemanshu Bhatt, Peter A. Burke, Byung Sung Kwak, Sey-Shing Sun +2 more |
2008-10-14 |
$11,302,000 |
| 7361965 |
Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design |
Derryl D. J. Allman, Hemanshu Bhatt, Peter A. Burke, Byung Sung Kwak, Sey-Shing Sun +2 more |
2008-04-22 |
$4,481,000 |
| 7358594 |
Method of forming a low k polymer E-beam printable mechanical support |
Derryl J. Allman |
2008-04-15 |
$10,580,000 |
| 7023067 |
Bond pad design |
Derryl D. J. Allman |
2006-04-04 |
$3,131,000 |
| 6972217 |
Low k polymer E-beam printable mechanical support |
Derryl J. Allman |
2005-12-06 |
$2,844,000 |
| 6967177 |
Temperature control system |
Hemanshu Bhatt |
2005-11-22 |
$4,910,000 |
| 6875693 |
Via and metal line interface capable of reducing the incidence of electro-migration induced voids |
Wilbur G. Catabay |
2005-04-05 |
$3,773,000 |
| 6743688 |
High performance MOSFET with modulated channel gate thickness |
Mark I. Gardner, H. James Fulford |
2004-06-01 |
$2,717,000 |
| 6707114 |
Semiconductor wafer arrangement of a semiconductor wafer |
Hemanshu Bhatt |
2004-03-16 |
$6,885,000 |
| 6654226 |
Thermal low k dielectrics |
Derryl D. J. Allman |
2003-11-25 |
$4,689,000 |
| 6638776 |
Thermal characterization compensation |
— |
2003-10-28 |
$9,204,000 |
| 6620729 |
Ion beam dual damascene process |
— |
2003-09-16 |
$7,469,000 |
| 6566244 |
Process for improving mechanical strength of layers of low k dielectric material |
Venkatesh P. Gopinath, Peter J. Wright |
2003-05-20 |
$2,301,000 |
| 6560504 |
Use of contamination-free manufacturing data in fault detection and classification as well as in run-to-run control |
Thomas J. Goodwin, Iraj Emami |
2003-05-06 |
$2,132,000 |
| 6544829 |
Polysilicon gate salicidation |
Venkatesh P. Gopinath, Mohammad Mirabedini, Arvind Kamath |
2003-04-08 |
$3,257,000 |
| 6531364 |
Advanced fabrication technique to form ultra thin gate dielectric using a sacrificial polysilicon seed layer |
Mark I. Gardner, H. Jim Fulford |
2003-03-11 |
$2,325,000 |
| 6521520 |
Semiconductor wafer arrangement and method of processing a semiconductor wafer |
Hemanshu Bhatt |
2003-02-18 |
$6,683,000 |
| 6495881 |
Programmable read only memory in CMOS process flow |
Shafqat Ahmed, Hemanshu Bhatt, Robindranath Banerjee |
2002-12-17 |
$2,785,000 |
| 6482075 |
Process for planarizing an isolation structure in a substrate |
Hemanshu Bhatt, Shafqat Ahmed, Robindranath Banerjee |
2002-11-19 |
$4,197,000 |
| 6451657 |
Transistor with an ultra short channel length defined by a laterally diffused nitrogen implant |
Mark I. Gardner, H. Jim Fulford |
2002-09-17 |
$1,456,000 |
| 6452412 |
Drop-in test structure and methodology for characterizing an integrated circuit process flow and topography |
Richard W. Jarvis, Iraj Emami |
2002-09-17 |
$1,456,000 |
| 6432812 |
Method of coupling capacitance reduction |
— |
2002-08-13 |
$4,311,000 |
