Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8410594 | Inter-stacking module system | Youngcheol Kim, Hun Teak Lee, Koo Hong Lee | 2013-04-02 |
| 7863737 | Integrated circuit package system with wire bond pattern | Byoung Wook Jang, Hun Teak Lee | 2011-01-04 |