Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769730 | Semiconductor device and method of providing high density component spacing | Minsu Kim, HeeSoo Lee | 2023-09-26 |
| 11367690 | Semiconductor device and method of forming an integrated SiP module with embedded inductor or package | DeokKyung Yang, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee | 2022-06-21 |
| 11309193 | Semiconductor device and method of forming SIP module over film layer | OhHan Kim, Kyunghwan KIM, HunTeak Lee, InSang Yoon | 2022-04-19 |
| 10804119 | Method of forming SIP module over film layer | OhHan Kim, Kyunghwan KIM, HunTeak Lee, InSang Yoon | 2020-10-13 |
| 10700011 | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package | DeokKyung Yang, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee | 2020-06-30 |
| 9693455 | Integrated circuit packaging system with plated copper posts and method of manufacture thereof | Seong Won Park, Hun Teak Lee, Minjung Kim, Changhwan Kim, ByungHyun Kwak +2 more | 2017-06-27 |