| 11769730 |
Semiconductor device and method of providing high density component spacing |
Minsu Kim, HeeSoo Lee |
2023-09-26 |
| 11367690 |
Semiconductor device and method of forming an integrated SiP module with embedded inductor or package |
DeokKyung Yang, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee |
2022-06-21 |
| 11309193 |
Semiconductor device and method of forming SIP module over film layer |
OhHan Kim, Kyunghwan KIM, HunTeak Lee, InSang Yoon |
2022-04-19 |
| 10804119 |
Method of forming SIP module over film layer |
OhHan Kim, Kyunghwan KIM, HunTeak Lee, InSang Yoon |
2020-10-13 |
| 10700011 |
Semiconductor device and method of forming an integrated SIP module with embedded inductor or package |
DeokKyung Yang, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee |
2020-06-30 |
| 9693455 |
Integrated circuit packaging system with plated copper posts and method of manufacture thereof |
Seong Won Park, Hun Teak Lee, Minjung Kim, Changhwan Kim, ByungHyun Kwak +2 more |
2017-06-27 |