Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245863 | Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights | Hae-Jung Yu, Kyung-Tae Na, Seung Hun Han, Tae-Sung Park, Choong Bin Yim | 2016-01-26 |
| 9111926 | Semiconductor package and package on package having the same | Dae-Young Choi, Mi-Yeon Kim | 2015-08-18 |
| 8759967 | Semiconductor package and package on package having the same | Dae-Young Choi, Mi-Yeon Kim | 2014-06-24 |
| 8531034 | Semiconductor package and package on package having the same | Dae-Young Choi, Mi-Yeon Kim | 2013-09-10 |
| 8304876 | Semiconductor package and method for manufacturing the same | Taehoon Kim, Jongkook Kim, Sang-Uk Han, Jung-Do Lee, Seonhyang You | 2012-11-06 |
| 8184449 | Electronic device having stack-type semiconductor package and method of forming the same | Jung-Do Lee, Tae Hun Kim, Sang-Uk Han, Seon-Hyang You | 2012-05-22 |
| 7795743 | Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package | Tae Hun Kim, Sung Yong Park, Heung-Kyu Kwon | 2010-09-14 |
| 7624498 | Apparatus for detaching a semiconductor chip from a tape | Youn Sung Ko, Jung-Hwan Woo, Hyun-Jung Song | 2009-12-01 |
| 7541680 | Semiconductor device package | Heung-Kyu Kwon, Se Nyun Kim, Tae Hun Kim, Jeong-O Ha, Sung Yong Park | 2009-06-02 |
| 6657272 | Off-axis silicon substrate for optimized optical coupling | Jing-Hua He, Muhammad Arif, Rao Yelamarty, Christina Arnold | 2003-12-02 |