Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9171827 | Stack type semiconductor package | Jin Ho Lee, Hee-Seok Lee, Se-Ho You | 2015-10-27 |
| 8817486 | Semiconductor package having multi pitch ball land | Tong-suk Kim, Heung-Kyu Kwon, Hyun A Kim | 2014-08-26 |
| 8400779 | Semiconductor package having multi pitch ball land | Tong-suk Kim, Heung-Kyu Kwon, Hyun A Kim | 2013-03-19 |
| 7776650 | Method for fabricating a flip chip system in package | Heung-Kyu Kwon, Tae Hun Kim | 2010-08-17 |
| 7723836 | Chip stack structure having shielding capability and system-in-package module using the same | Houng-Kyu Kwon | 2010-05-25 |
| 7541680 | Semiconductor device package | Heung-Kyu Kwon, Se Nyun Kim, Tae Hun Kim, Hak-Kyoon Byun, Sung Yong Park | 2009-06-02 |
| 7517723 | Method for fabricating a flip chip system in package | Heung-Kyu Kwon, Tae Hun Kim | 2009-04-14 |