Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132009 | Semiconductor package | — | 2024-10-29 |
| 11646275 | Semiconductor package | — | 2023-05-09 |
| 11088091 | Semiconductor package | — | 2021-08-10 |
| 10651133 | Semiconductor package | — | 2020-05-12 |
| 9698088 | Semiconductor packages | Heungkyu Kwon, Kang Joon LEE, Jaewook Yoo | 2017-07-04 |
| 9601458 | Stacked semiconductor package including connections electrically connecting first and second semiconductor packages | Heung-Kyu Kwon | 2017-03-21 |
| 9048168 | Semiconductor packages having warpage compensation | Heung-Kyu Kwon, Seok-Won Lee, Hyon-chol Kim, Chi-Young Lee | 2015-06-02 |
| 9040351 | Stack packages having fastening element and halogen-free inter-package connector | Heung-Kyu Kwon, Jae-Wook Yoo, Hyon-chol Kim, Min-Ok Na | 2015-05-26 |
| 8716872 | Stacked semiconductor package including connections electrically connecting first and second semiconductor packages | Heung-Kyu Kwon | 2014-05-06 |
| 8604614 | Semiconductor packages having warpage compensation | Heung-Kyu Kwon, Seok-Won Lee, Hyon-chol Kim, Chi-Young Lee | 2013-12-10 |
| 8546954 | Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package | Heung-Kyu Kwon | 2013-10-01 |
| 7868443 | Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability | Heung-Kyu Kwon, Tae Hun Kim | 2011-01-11 |
| 7615415 | Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability | Heung-Kyu Kwon, Tae Hun Kim | 2009-11-10 |