Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374558 | Laser-assisted bonding apparatus for bonding an electronic device to a substrate | Tae Ho Yoon, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim | 2025-07-29 |
| 11742216 | System and method for laser assisted bonding of an electronic device | Tae Ho Yoon, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim | 2023-08-29 |
| 11664331 | Semiconductor package | Chul Woo Kim, Sang Min Yong | 2023-05-30 |
| 11217503 | Semiconductor package having logic semiconductor chip and memory packages on interposer | Chul Woo Kim, Hyo-Chang Ryu, Seung-Kwan Ryu, Yun-Seok Choi | 2022-01-04 |
| 11139253 | Semiconductor package | Chui Woo Kim, Sang Min Yong | 2021-10-05 |
| 10763129 | System and method for laser assisted bonding of an electronic device | Tae Ho Yoon, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim | 2020-09-01 |
| 10304698 | System and method for laser assisted bonding of semiconductor die | Tae Ho Yoon, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim | 2019-05-28 |
| 9916989 | System and method for laser assisted bonding of semiconductor die | Tae Ho Yoon, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim | 2018-03-13 |
| 9627348 | Laser assisted bonding for semiconductor die interconnections | Dong Su Ryu, Choon Heung Lee, Min Ho Kim, Choong Hoe Kim, Ju Hoon Yoon +1 more | 2017-04-18 |