Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230556 | Semiconductor package and method of fabricating the same | Jongyoun Kim, Hyeonseok LEE, Gwangjae Jeon | 2025-02-18 |
| 12160005 | Black metallic nanorod arrays and method of manufacturing thereof | Da Deng | 2024-12-03 |
| 12014975 | Semiconductor package | Jaegwon Jang, Kyoung Lim Suk | 2024-06-18 |
| 11973028 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Seokhyun Lee | 2024-04-30 |
| 11948872 | Semiconductor package and method of fabricating the same | Jongyoun Kim, Hyeonseok LEE, Gwangjae Jeon | 2024-04-02 |
| 11894338 | Wafer level package | Jinwoo Park, Jungho Park, Dahye Kim | 2024-02-06 |
| 11600564 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Seokhyun Lee | 2023-03-07 |
| 11264354 | Wafer level package | Jinwoo Park, Jungho Park, Dahye Kim | 2022-03-01 |
| 10950539 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Seokhyun Lee | 2021-03-16 |