Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Via-in-pad with off-center geometry

Via-in-pad with off-center geometry

US Patent 6833615 · Granted Dec 21, 2004

Estimated economic value: $44,553,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

BGA stiffener attachment with low Eolife adhesive strength at high solder joint 2025
Semiconductor chip package thermo-mechanical cooling assembly2025
Cooling assembly with strap element to diminish lateral movement of cooling mass2025
DIMM retention assembly for compression mount technology and land grid array con2025
Technologies for processor loading mechanisms2025
Magnetically secured semiconductor chip package loading assembly2025
Thermally conductive chamber with stiffening structure for thermal cooling assem2025
Patterned bolster plate and composite back plate for semiconductor chip LGA pack2025
Electronic systems with inverted circuit board with heat sink to chassis attachm2024
Cold plate architecture for liquid cooling of devices2024
Retention latch with spring mechanism2024
Electronic systems with inverted circuit board with heat sink to chassis attachm2023