Patents per Year
Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7208348 | Methods of fabricating a via-in-pad with off-center geometry | Phil Geng | 2007-04-24 | $13,574,000 |
| 7036712 | Methods to couple integrated circuit packages to bonding pads having vias | Dan Shier | 2006-05-02 | $12,289,000 |
| 6833615 | Via-in-pad with off-center geometry | Phil Geng | 2004-12-21 | $44,553,000 |
| 6429389 | Via-in-pad apparatus and methods | Ji Yoon Chung | 2002-08-06 | $50,822,000 |
| 6395995 | Apparatus for coupling integrated circuit packages to bonding pads having vias | Dan Shier | 2002-05-28 | $93,259,000 |
| 6046909 | Computer card with a printed circuit board with vias providing strength to the printed circuit board | — | 2000-04-04 | $215,158,000 |