Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7036712 | Methods to couple integrated circuit packages to bonding pads having vias | Stephen C. Joy | 2006-05-02 |
| 6395995 | Apparatus for coupling integrated circuit packages to bonding pads having vias | Stephen C. Joy | 2002-05-28 |