Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12279395 | Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention | Phil Geng, Ralph V. Miele, David Shia, Jeffory L. Smalley, Eric W. Buddrius +2 more | 2025-04-15 |
| 12133357 | Cold plate architecture for liquid cooling of devices | Jin Yang, David Shia, Mohanraj Prabhugoud, Craig Jahne, Phil Geng | 2024-10-29 |
| 11678444 | Loading mechanism with integrated heatsink | Mark Hemmeyer, Mengqi Liu | 2023-06-13 |