Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8093697 | Microelectronic packages and methods therefor | Belgacem Haba, Ilyas Mohammed, Ellis Chau | 2012-01-10 |
| 8058101 | Microelectronic packages and methods therefor | Belgacem Haba, Ilyas Mohammed, Ellis Chau | 2011-11-15 |
| 8046912 | Method of making a connection component with posts and pads | Yoichi Kubota, Jae M. Park, Belgacem Haba | 2011-11-01 |
| 7999397 | Microelectronic packages and methods therefor | Belgacem Haba, Masud Beroz, Yoichi Kubota, Sridhar Krishnan, John Riley +1 more | 2011-08-16 |
| 7883937 | Electronic package and method of forming the same | Yuan-Liang Li, Yuanlin Xie | 2011-02-08 |
| 7745943 | Microelectonic packages and methods therefor | Belgacem Haba, Masud Beroz, Yoichi Kubota, Sridhar Krishnan, John Riley +1 more | 2010-06-29 |
| 7709968 | Micro pin grid array with pin motion isolation | Philip Damberg, Belgacem Haba, David B. Tuckerman | 2010-05-04 |
| 7659617 | Substrate for a flexible microelectronic assembly and a method of fabricating thereof | Jae M. Park, Yoichi Kubota | 2010-02-09 |
| 7495179 | Components with posts and pads | Yoichi Kubota, Jae M. Park, Belgacem Haba | 2009-02-24 |
| 7453157 | Microelectronic packages and methods therefor | Belgacem Haba, Masud Beroz, Yoichi Kubota, Sridhar Krishnan, John Riley +1 more | 2008-11-18 |
| 7397068 | Solid state lighting device | Jae M. Park | 2008-07-08 |
| 7368695 | Image sensor package and fabrication method | Michael Estrella, Jae M. Park, Kenneth R. Thompson, Craig Mitchell, Belgacem Haba | 2008-05-06 |
| 7304376 | Microelectronic assemblies with springs | Belgacem Haba, Jae M. Park, Nicholas Colella | 2007-12-04 |
| 7268426 | High-frequency chip packages | Michael Warner, Lee Smith, Belgacem Haba, Glenn Urbish, Masud Beroz | 2007-09-11 |
| 7246431 | Methods of making microelectronic packages including folded substrates | Kyong-Mo Bang | 2007-07-24 |
| 7176506 | High frequency chip packages with connecting elements | Masud Beroz, Michael Warner, Lee Smith, Glenn Urbish, Jae M. Park +1 more | 2007-02-13 |
| 7071547 | Assemblies having stacked semiconductor chips and methods of making same | Yoichi Kubota | 2006-07-04 |
| 7053485 | Microelectronic packages with self-aligning features | Kyong-Mo Bang, Jae M. Park | 2006-05-30 |
| 5939776 | Lead frame structure having non-removable dam bars for semiconductor package | Dong You Kim | 1999-08-17 |