Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830845 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2023-11-28 |
| 11424211 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2022-08-23 |
| 10833044 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2020-11-10 |
| 10593643 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2020-03-17 |
| 10090276 | Semiconductor package to reduce warping | — | 2018-10-02 |
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2018-08-28 |
| 9786611 | Method for manufacturing a semiconductor package | Yasuyuki TAKEHARA | 2017-10-10 |
| 9716075 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Yoshikuni Nakadaira, Norihito Masuda +3 more | 2017-07-25 |
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2017-06-27 |
| 9418944 | Semiconductor package | Yasuyuki TAKEHARA | 2016-08-16 |
| 9337165 | Method for manufacturing a fan-out WLP with package | Hiroaki Sato, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed +1 more | 2016-05-10 |
| 9224717 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2015-12-29 |
| 9137903 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Yoshikuni Nakadaira, Norihito Masuda +3 more | 2015-09-15 |
| 9093435 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2015-07-28 |
| 8890304 | Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material | Hiroaki Sato, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed +1 more | 2014-11-18 |
| 8618659 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2013-12-31 |
| 8525338 | Chip with sintered connections to package | Hiroaki Sato, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed +1 more | 2013-09-03 |