Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716075 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Norihito Masuda +3 more | 2017-07-25 |
| 9337165 | Method for manufacturing a fan-out WLP with package | Hiroaki Sato, Kiyoaki Hashimoto, Norihito Masuda, Belgacem Haba, Ilyas Mohammed +1 more | 2016-05-10 |
| 9137903 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Norihito Masuda +3 more | 2015-09-15 |
| 8957520 | Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts | Hiroaki Sato, Yukio Hashimoto, Norihito Masuda, Belgacem Haba, Ilyas Mohammed +1 more | 2015-02-17 |
| 8890304 | Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material | Hiroaki Sato, Kiyoaki Hashimoto, Norihito Masuda, Belgacem Haba, Ilyas Mohammed +1 more | 2014-11-18 |
| 8525338 | Chip with sintered connections to package | Hiroaki Sato, Kiyoaki Hashimoto, Norihito Masuda, Belgacem Haba, Ilyas Mohammed +1 more | 2013-09-03 |
| 5763946 | Semiconductor device with bent electrode terminal | Norio Kawakami, Takahiro Ito | 1998-06-09 |