Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7569424 | Method of forming a wall structure in a microelectronic assembly | Michael J. Nystrom, Christopher Wade | 2009-08-04 |
| 7545029 | Stack microelectronic assemblies | Stuart E. Wilson, Ronald Green, Richard Dewitt Crisp | 2009-06-09 |
| 7521276 | Compliant terminal mountings with vented spaces and methods | Michael J. Nystrom, Belgacem Haba | 2009-04-21 |
| 7510401 | Microelectronic component with foam-metal posts | Jesse Thompson | 2009-03-31 |
| 7485956 | Microelectronic package optionally having differing cover and device thermal expansivities | David B. Tuckerman | 2009-02-03 |
| 7453139 | Compliant terminal mountings with vented spaces and methods | Michael J. Nystrom, Belgacem Haba | 2008-11-18 |
| 7449779 | Wire bonded wafer level cavity package | Kenneth Honer, David B. Tuckerman, Michael J. Nystrom | 2008-11-11 |
| 7443597 | Liquid lens with piezoelectric voltage converter | — | 2008-10-28 |
| 7317249 | Microelectronic package having stacked semiconductor devices and a process for its fabrication | Richard Dewitt Crisp, Belgacem Haba | 2008-01-08 |
| 7298030 | Structure and method of making sealed capped chips | Bruce M. McWilliams, Belgacem Haba, David B. Tuckerman | 2007-11-20 |
| 7262368 | Connection structures for microelectronic devices and methods for forming such structures | Belgacem Haba, Masud Beroz, David B. Tuckerman, Richard Dewitt Crisp | 2007-08-28 |
| 7224056 | Back-face and edge interconnects for lidded package | Robert Burtzlaff, Belgacem Haba, David B. Tuckerman, Michael Warner, Craig Mitchell | 2007-05-29 |
| 7157309 | Manufacture of microelectronic fold packages | Nicholas Colella | 2007-01-02 |
| 7129576 | Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps | — | 2006-10-31 |
| 7026744 | Remote control and power system | Anthony Needham, Anthony J. Salloway | 2006-04-11 |
| 6958446 | Compliant and hermetic solder seal | Yoshikatsu Ichimura, Nancy M. Mar, Daniel J. Miller, Michael J. Nystrom, Heidi Linch Reynolds +1 more | 2005-10-25 |
| 6732905 | Vented cavity, hermetic solder seal | Yoshikatsu Ichimura, Nancy M. Mar, Daniel J. Miller, Michael J. Nystrom, Gary R. Trott | 2004-05-11 |
| 6493231 | Electrical apparatus | Brian Frederick Nicholson, David M. Jacobson, Surinder Pal Singh Sangha, James H. Vincent, William Martin Lovell | 2002-12-10 |
| 5106009 | Methods of joining components | David M. Jacobson | 1992-04-21 |
| 5073210 | Method of making electrical conductors | David M. Jacobson | 1991-12-17 |
| 5031822 | Methods of joining components | David M. Jacobson, Brian P. Cameron | 1991-07-16 |