Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10440822 | Interposers with electrically conductive features having different porosities | Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2019-10-08 |
| 10381326 | Structure and method for integrated circuits packaging with increased density | Charles G. Woychik, Arkalgud R. Sitaram, Andrew Cao | 2019-08-13 |
| 9769923 | Interposers | Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2017-09-19 |
| 9570385 | Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks | Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2017-02-14 |