Issued Patents All Time
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855064 | Techniques for processing devices | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2023-12-26 |
| 11749645 | TSV as pad | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba +1 more | 2023-09-05 |
| 11664357 | Techniques for joining dissimilar materials in microelectronics | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu | 2023-05-30 |
| 11652083 | Processed stacked dies | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2023-05-16 |
| 11626363 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz +1 more | 2023-04-11 |
| 11515279 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Guilian Gao | 2022-11-29 |
| 11393779 | Large metal pads over TSV | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba +1 more | 2022-07-19 |
| 11367652 | Microelectronic assembly from processed substrate | Cyprian Emeka Uzoh | 2022-06-21 |
| 11355404 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Guilian Gao, Gaius Gillman Fountain, Jr. | 2022-06-07 |
| 11296053 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more | 2022-04-05 |
| 11244916 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao | 2022-02-08 |
| 11195748 | Interconnect structures and methods for forming same | Cyprian Emeka Uzoh | 2021-12-07 |
| 11037919 | Techniques for processing devices | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2021-06-15 |
| 11011494 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics | Guilian Gao, Gaius Gillman Fountain, Jr., Rajesh Katkar, Ilyas Mohammed, Cyprian Emeka Uzoh | 2021-05-18 |
| 11004757 | Bonded structures | Rajesh Katkar, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh | 2021-05-11 |
| 10879212 | Processed stacked dies | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2020-12-29 |
| 10790262 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Guilian Gao | 2020-09-29 |
| 10727219 | Techniques for processing devices | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2020-07-28 |
| 10672654 | Microelectronic assembly from processed substrate | Cyprian Emeka Uzoh | 2020-06-02 |
| 10658313 | Selective recess | Javier A. Delacruz, Rajesh Katkar, Shaowu Huang, Gaius Gillman Fountain, Jr., Liang Wang | 2020-05-19 |
| 10586759 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh | 2020-03-10 |
| 10440822 | Interposers with electrically conductive features having different porosities | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Arkalgud R. Sitaram | 2019-10-08 |
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh | 2018-07-03 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2018-06-26 |
| 9899353 | Off-chip vias in stacked chips | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky | 2018-02-20 |