Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960840 | Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level | Thomas D. Bonifield, William R. Morrison, Gregory D. Winterton, Asad Haider | 2011-06-14 |
| 6707936 | Method and apparatus for predicting device yield from a semiconductor wafer | Thomas K. Powell, Jr., Steven M. James | 2004-03-16 |