Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960840 | Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level | Thomas D. Bonifield, Thomas W. Winter, William R. Morrison, Asad Haider | 2011-06-14 |