Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8236703 | Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom | Lisa A. Fritz, Lin Li, Lee Alan Stringer, Neel Bhatt, John Paul Campbell +2 more | 2012-08-07 |
| 8110416 | AC impedance spectroscopy testing of electrical parametric structures | He Lin | 2012-02-07 |
| 7998865 | Systems and methods for removing wafer edge residue and debris using a residue remover mechanism | Joe G. Tran, Brian K. Kirkpatrick | 2011-08-16 |
| 7332425 | Simultaneous deposition and etch process for barrier layer formation in microelectronic device interconnects | Asad Haider, Kelly Taylor | 2008-02-19 |
| 7323409 | Method for forming a void free via | Adel El Sayed, John Paul Campbell, Clint Montgomery | 2008-01-29 |
| 6977437 | Method for forming a void free via | Adel Sayed, John Paul Campbell, Clint Montgomery | 2005-12-20 |
| 6617231 | Method for forming a metal extrusion free via | Antonietta Oliva, Adel Sayed | 2003-09-09 |
| 6002259 | Electrostatic adhesion tester for thin film conductors | Franz R. Brotzen, Daniel Callahan, Haining Yang | 1999-12-14 |