Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Properties of metallic copper diffusion barriers through silicon surface treatments

Properties of metallic copper diffusion barriers through silicon surface treatments

US Patent 8211794 · Granted Jul 3, 2012

Estimated economic value: $8,351,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Authenticate a user before performing a sensitive operation associated with a UE2025
MRAM device with integrated controller for FPGA system and methods therefor2025
Magnetoresistive stack/structure and method of manufacturing same2025
Systems and methods for configuration of a configuration bit with a value2025
Cryptographic MRAM and methods thereof2025
Method of manufacturing integrated circuit using encapsulation during an etch pr2025
Magnetoresistive stack/structure and methods therefor2024
Magnetoresistive stack with seed region and method of manufacturing the same2024
Methods of forming magnetoresistive devices and integrated circuits2024
Method of manufacturing integrated circuit using encapsulation during an etch pr2024
Methods for manufacturing magnetoresistive stack devices2024
Magnetoresistive structure having two dielectric layers, and method of manufactu2024