Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9816194 | Control of electrolyte flow dynamics for uniform electroplating | Zhian He, Jian Zhou, Jingbin Feng, Jonathan D. Reid | 2017-11-14 |
| 9735035 | Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing | Manish Ranjan, Cian Sweeney | 2017-08-15 |
| 9685353 | Apparatus and method for edge bevel removal of copper from silicon wafers | Kousik Ganesan, Tariq Majid, Aaron Louis LaBrie, Steven T. Mayer | 2017-06-20 |
| 9677190 | Membrane design for reducing defects in electroplating systems | Doyeon KIM, Yuichi Takada, Ludan Huang, Tariq Majid | 2017-06-13 |
| 9587322 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Frederick Dean Wilmot, Douglas Hill, Bryan L. Buckalew | 2017-03-07 |
| 9512538 | Plating cup with contoured cup bottom | Zhian He, Jingbin Feng, Frederick Dean Wilmot | 2016-12-06 |
| 9340893 | Front referenced anode | Jingbin Feng, R. Marshall Stowell, Zhian He, Frederick Dean Wilmot | 2016-05-17 |
| 9028666 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Frederick Dean Wilmot, Douglas Hill, Bryan L. Buckalew | 2015-05-12 |
| 9028657 | Front referenced anode | Jingbin Feng, R. Marshall Stowell, Zhian He, Frederick Dean Wilmot | 2015-05-12 |
| 8540857 | Plating method and apparatus with multiple internally irrigated chambers | Steven T. Mayer, Kousik Ganesan, Zhian He, Jingbin Feng | 2013-09-24 |
| 8398831 | Rapidly cleanable electroplating cup seal | Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan +2 more | 2013-03-19 |
| 8377268 | Electroplating cup assembly | Robert Rash, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins +2 more | 2013-02-19 |
| 8262871 | Plating method and apparatus with multiple internally irrigated chambers | Steven T. Mayer, Kousik Ganesan, Zhian He, Jingbin Feng | 2012-09-11 |
| 8172992 | Wafer electroplating apparatus for reducing edge defects | Vinay Prabhakar, Bryan L. Buckalew, Kousik Ganesan, Zhian He, Steven T. Mayer +4 more | 2012-05-08 |
| 7985325 | Closed contact electroplating cup assembly | Robert Rash, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins +2 more | 2011-07-26 |
| 7935231 | Rapidly cleanable electroplating cup assembly | Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan +2 more | 2011-05-03 |