Issued Patents All Time
Showing 26–50 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9689083 | TSV bath evaluation using field versus feature contrast | Lee J. Brogan, Steven T. Mayer, Matthew Thorum, Joseph Richardson, Haiying Fu | 2017-06-27 |
| 9677188 | Electrofill vacuum plating cell | R. Marshall Stowell, Jingbin Feng | 2017-06-13 |
| 9617652 | Bubble and foam solutions using a completely immersed air-free feedback flow control valve | Richard Abraham, Robert Rash, Steven T. Mayer, John Floyd Ostrowski | 2017-04-11 |
| 9534308 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, Steven T. Mayer, Thomas A. Ponnuswamy | 2017-01-03 |
| 9523155 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo +1 more | 2016-12-20 |
| 9464361 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer | 2016-10-11 |
| 9449808 | Apparatus for advanced packaging applications | Bryan L. Buckalew, Steven T. Mayer, Thomas A. Ponnuswamy | 2016-09-20 |
| 9447505 | Wet etching methods for copper removal and planarization in semiconductor processing | Steven T. Mayer, Eric G. Webb | 2016-09-20 |
| 9412713 | Treatment method of electrodeposited copper for wafer-level-packaging process flow | Bryan L. Buckalew, Steven T. Mayer, Thomas A. Ponnuswamy | 2016-08-09 |
| 9404194 | Electroplating apparatus and process for wafer level packaging | Steven T. Mayer | 2016-08-02 |
| 9393739 | Rack type pipe feeder for a pipe fusion machine | James R. Perrault, Brandon William Jackman, William Barton Draeger, Bobby Lee Murray, Timothy M. Thoman +1 more | 2016-07-19 |
| 9394620 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Edwin Goh, Bryan L. Buckalew, Robert Rash | 2016-07-19 |
| 9296154 | Tapered wattage radial heater | — | 2016-03-29 |
| 9260793 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, Bryan L. Buckalew, Robert Rash | 2016-02-16 |
| 9242410 | Top-loading straddle-mounted pipe fusion machine | Jason A. Lawrence, James R. Perrault, Timothy M. Thoman, Bobby Lee Murray | 2016-01-26 |
| 9139927 | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system | Robert Rash, Richard Abraham, Steven T. Mayer | 2015-09-22 |
| 9074287 | Reduced isotropic etchant material consumption and waste generation | Steven T. Mayer | 2015-07-07 |
| 9074286 | Wet etching methods for copper removal and planarization in semiconductor processing | Steven T. Mayer, Eric G. Webb | 2015-07-07 |
| 9045840 | Dynamic current distribution control apparatus and method for wafer electroplating | Jonathan D. Reid, Frederick Dean Wilmot | 2015-06-02 |
| 8962085 | Wetting pretreatment for enhanced damascene metal filling | Steven T. Mayer, Mark J. Willey | 2015-02-24 |
| 8858774 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, Bryan L. Buckalew, Robert Rash | 2014-10-14 |
| 8795480 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer | 2014-08-05 |
| 8690517 | Rack type pipe feeder for a pipe fusion machine | James R. Perrault, Brandon William Jackman, William Barton Draeger, Bobby Lee Murray, Timothy M. Thoman +1 more | 2014-04-08 |
| 8603305 | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system | Robert Rash, Richard Abraham, Steven T. Mayer | 2013-12-10 |
| 8597461 | Reduced isotropic etchant material consumption and waste generation | Steven T. Mayer | 2013-12-03 |