Issued Patents All Time
Showing 26–50 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10407794 | Methods and apparatuses for electroplating and seed layer detection | Daniel Mark Dinneen | 2019-09-10 |
| 10364505 | Dynamic modulation of cross flow manifold during elecroplating | Kari Thorkelsson, Aaron Berke, Bryan L. Buckalew | 2019-07-30 |
| 10309024 | Electroplating apparatus and process for wafer level packaging | David W. Porter | 2019-06-04 |
| 10301738 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Thomas A. Ponnuswamy, Robert Rash, Brian Paul Blackman, Doug Higley | 2019-05-28 |
| 10208395 | Bubble and foam solutions using a completely immersed air-free feedback flow control valve | Richard Abraham, Robert Rash, David W. Porter, John Floyd Ostrowski | 2019-02-19 |
| 10196753 | Methods and apparatuses for electroplating and seed layer detection | Daniel Mark Dinneen | 2019-02-05 |
| 10190230 | Cross flow manifold for electroplating apparatus | Richard Abraham, Bryan L. Buckalew, Robert Rash | 2019-01-29 |
| 10190232 | Apparatuses and methods for maintaining pH in nickel electroplating baths | Bryan L. Buckalew, Thomas A. Ponnuswamy, Ben Foley | 2019-01-29 |
| 10128102 | Methods and apparatus for wetting pretreatment for through resist metal plating | Lee Peng Chua, Bryan L. Buckalew, Thomas A. Ponnuswamy, Brian Paul Blackman, Chad Michael Hosack | 2018-11-13 |
| 10106907 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, David W. Porter, Thomas A. Ponnuswamy | 2018-10-23 |
| 10094038 | Monitoring electrolytes during electroplating | Matthew Thorum | 2018-10-09 |
| 10094034 | Edge flow element for electroplating apparatus | Gabriel Hay Graham, Bryan L. Buckalew, Robert Rash, James Isaac Fortner, Lee Peng Chua | 2018-10-09 |
| 10092933 | Methods and apparatuses for cleaning electroplating substrate holders | Santosh Kumar, Bryan L. Buckalew, Thomas A. Ponnuswamy, Chad Michael Hosack, Robert Rash +2 more | 2018-10-09 |
| 10087545 | Automated cleaning of wafer plating assembly | Thomas A. Ponnuswamy, Lee Peng Chua, Robert Rash | 2018-10-02 |
| 10053793 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Aaron Berke, Robert Rash, Santosh Kumar, Lee Peng Chua | 2018-08-21 |
| 10017869 | Electroplating apparatus for tailored uniformity profile | David W. Porter, Bryan L. Buckalew, Robert Rash | 2018-07-10 |
| 10014170 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, Robert Rash | 2018-07-03 |
| 10011919 | Electrolyte delivery and generation equipment | Gregory J. Kearns, Richard Abraham, Lawrence Ossowski | 2018-07-03 |
| 9988733 | Apparatus and method for modulating azimuthal uniformity in electroplating | Gabriel Hay Graham, Lee Peng Chua, Robert Rash, Aaron Berke | 2018-06-05 |
| 9982357 | Electroplating apparatus and process for wafer level packaging | David W. Porter | 2018-05-29 |
| 9899230 | Apparatus for advanced packaging applications | Bryan L. Buckalew, David W. Porter, Thomas A. Ponnuswamy | 2018-02-20 |
| 9856574 | Monitoring leveler concentrations in electroplating solutions | — | 2018-01-02 |
| 9852913 | Wetting pretreatment for enhanced damascene metal filling | David W. Porter, Mark J. Willey | 2017-12-26 |
| 9834852 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo, Robert Rash +1 more | 2017-12-05 |
| 9828688 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Thomas A. Ponnuswamy, Robert Rash, Brian Paul Blackman, Doug Higley | 2017-11-28 |