Issued Patents All Time
Showing 51–75 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9822460 | Methods and apparatuses for electroplating and seed layer detection | Daniel Mark Dinneen | 2017-11-21 |
| 9816196 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Tighe A. Spurlin, Charles Merrill, Ludan Huang, Matthew Thorum, Lee J. Brogan +9 more | 2017-11-14 |
| 9746427 | Detection of plating on wafer holding apparatus | Haiying Fu, Thomas A. Ponnuswamy, Bryan L. Buckalew | 2017-08-29 |
| 9721800 | Apparatus for wetting pretreatment for enhanced damascene metal filling | David W. Porter, Mark J. Willey, Robert Rash | 2017-08-01 |
| 9689083 | TSV bath evaluation using field versus feature contrast | Lee J. Brogan, Matthew Thorum, Joseph Richardson, David W. Porter, Haiying Fu | 2017-06-27 |
| 9685353 | Apparatus and method for edge bevel removal of copper from silicon wafers | Kousik Ganesan, Shantinath Ghongadi, Tariq Majid, Aaron Louis LaBrie | 2017-06-20 |
| 9624592 | Cross flow manifold for electroplating apparatus | Richard Abraham, Bryan L. Buckalew, Robert Rash | 2017-04-18 |
| 9617652 | Bubble and foam solutions using a completely immersed air-free feedback flow control valve | Richard Abraham, Robert Rash, David W. Porter, John Floyd Ostrowski | 2017-04-11 |
| 9617648 | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias | Matthew Thorum | 2017-04-11 |
| 9613833 | Methods and apparatus for wetting pretreatment for through resist metal plating | Lee Peng Chua, Bryan L. Buckalew, Thomas A. Ponnuswamy, Brian Paul Blackman, Chad Michael Hosack | 2017-04-04 |
| 9593426 | Through silicon via filling using an electrolyte with a dual state inhibitor | Mark J. Willey | 2017-03-14 |
| 9567685 | Apparatus and method for dynamic control of plated uniformity with the use of remote electric current | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, James Isaac Fortner +1 more | 2017-02-14 |
| 9534308 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, David W. Porter, Thomas A. Ponnuswamy | 2017-01-03 |
| 9523155 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo, Robert Rash +1 more | 2016-12-20 |
| 9476139 | Cleaning electroplating substrate holders using reverse current deplating | Lee Peng Chua, Thomas A. Ponnuswamy, Santosh Kumar | 2016-10-25 |
| 9464361 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | David W. Porter | 2016-10-11 |
| 9455139 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Thomas A. Ponnuswamy, Robert Rash, Brian Paul Blackman, Doug Higley | 2016-09-27 |
| 9449808 | Apparatus for advanced packaging applications | Bryan L. Buckalew, David W. Porter, Thomas A. Ponnuswamy | 2016-09-20 |
| 9447505 | Wet etching methods for copper removal and planarization in semiconductor processing | Eric G. Webb, David W. Porter | 2016-09-20 |
| 9412713 | Treatment method of electrodeposited copper for wafer-level-packaging process flow | Bryan L. Buckalew, Thomas A. Ponnuswamy, David W. Porter | 2016-08-09 |
| 9404194 | Electroplating apparatus and process for wafer level packaging | David W. Porter | 2016-08-02 |
| 9394620 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | David W. Porter, Edwin Goh, Bryan L. Buckalew, Robert Rash | 2016-07-19 |
| 9385035 | Current ramping and current pulsing entry of substrates for electroplating | Tighe A. Spurlin, Jian Zhou, Edward C. Opocensky, Jonathan D. Reid | 2016-07-05 |
| 9359688 | Apparatuses and methods for controlling PH in electroplating baths | Lee Peng Chua, Thomas A. Ponnuswamy, Mark L. Rea | 2016-06-07 |
| 9309605 | Monitoring leveler concentrations in electroplating solutions | — | 2016-04-12 |